IEC 60068-2-2:2007 is the definitive international standard for assessing the resilience of electrotechnical products against high-temperature, low-humidity environments (“Dry Heat”). This test simulates extreme thermal stress to verify structural integrity and operational stability during storage, transportation, and usage.
- Specimen Classification: Distinct testing methods (Tests Bb, Bd, Be) are applied based on whether the product is heat-dissipating (active) or non-heat-dissipating (passive).
- Failure Analysis: Detects potential issues such as material warping, seal degradation, and electronic drift under thermal load.
- Operational Integrity: Ensures devices maintain performance functionality without thermal runaway in harsh climates.